Research context and placement

The Crossref-confirmed title explicitly concerns IC-chip/deformable-circuit packaging, fitting the interconnect–chip boundary. The complete abstract is unavailable, so specific methods and performance remain unclassified.

Public verification result

Crossref confirms title, DOI, volume and article number but has no abstract. ScienceDirect search exposed fragments; direct page access failed, so no complete abstract review is claimed.

Review priorities

Editorial questions: Which chips, joint pitches and substrates are compared, and what supports reliability?

Conditions for later comparison

Future comparisons should reconcile contact resistance, isolation spacing, assembly temperature/pressure, cyclic deformation and failure criteria.

Candidate external research

Fully solution processed liquid metal features as highly conductive and ultrastretchable conductors

DOI: 10.1038/s41528-021-00123-x ↗

Its abstract verifies LED-chip/liquid-metal interconnection as a concrete component-joining example, retained as a candidate comparison for #100's framework.

An LED array does not validate high-density IC joint yield, pitch or reliability; inclusion in #100 is also unverified.

Abstract checked

Corresponding-author verification

Correspondence unresolved

This record concerns Jungmok Seo’s correspondence designation. Author order or an asterisk alone is not treated as confirmation; this check is separate from verification of the research content.

Main-text review scope
Crossref confirms title, DOI, volume and article number but has no abstract. ScienceDirect search exposed fragments; direct page access failed, so no complete abstract review is claimed.
Supplementary review scope
Supplementary-information content was not read in this batch. No completed review beyond the previously stated scope is claimed.
Pending verification
Verify DOI 10.1016/j.mser.2026.101285, abstract, main text and comparison tables in school Chrome. Original metadata remains untouched; no numerical results or fabrication procedures were added.

COVERAGE & OUTREACH

Coverage and outreach

Links are checked for their relationship to this paper. Media publication does not establish independent reporting or additional experimental validation.

  • Jungmok Seo · LinkedIn · Date unconfirmed · Researcher-authored post

    Bridging IC chips and deformable circuits — Jungmok Seo의 연구 소개 ↗

    The public post gives the exact title of #100, MSE R, and the packaging architectures.

    Body read The public post body was read. Its relative timestamp (1d) is not converted into an inferred date. This is the researcher’s own post, not independent reporting.

Channel coverage and search log for all 101 records →

Sources and verification scope

Crossref confirms title, DOI, volume and article number but has no abstract. ScienceDirect search exposed fragments; direct page access failed, so no complete abstract review is claimed.