Interconnect–chip and substrate–component junctions. Classification centers on connecting and assembling functional components.
Connects deformable wiring to functional components and examines contact resistance, electrical isolation, mechanical compatibility and process compatibility together.
Primary assignments in this theme: 39 · Subthemes are editorial proposals for this library. Title-based classification is distinct from full-text verification.
Research on assembling compatible component joints, electrical contacts and encapsulation structures. Protection and transport control also span the other themes.
Materials Science and Engineering R: Reports, 171, 101285 (2026)
The Crossref-confirmed title explicitly concerns IC-chip/deformable-circuit packaging, fitting the interconnect–chip boundary. The complete abstract is unavailable, so specific methods and performance remain unclassified.
Small, 22(17), e10949 (2026)
Locally read interlayer adhesion, barrier and electrical-insulation evidence fits protective packaging. Acute inflammatory/tissue responses after seven-day subcutaneous implantation support a host cross-link, without establishing chronic biocompatibility.
Advanced Electronic Materials, 11(19), e00475 (2025)
OLED barrier and mechanical stability fit protective packaging. Its breadth from conventional displays to biointegration requires a qualified boundary; skin conformity is secondary.
Research centered on connecting sensors, stimulation or actuation elements and circuits into a system. Sensing performance alone does not establish this classification.
ACS Nano, 18(19), 12210-12224 (2024)
A chip-free wireless system combines a capacitive fiber sensor, inductive coil and suture fixation. It extends component integration to sensor-system assembly without demonstrating an interconnect–chip junction. Antifouling and tissue fixation provide host and tissue cross-links.
Advanced Electronic Materials, 10(8), 2400013 (2024)
Joining the hydrogel electrode and elastomer triboelectric layer to a power-management circuit establishes a system-assembly focus. Tissue contact and stretchable conduction are secondary.
ACS Nano, 17(8), 7296–7310 (2023)
Self-bonding of a shared polymer joins the conduit and flow sensor. Resealing mechanics and the antithrombotic lubricant interface are secondary connections.
Nanoscale, 13(43), 18112-18124 (2021)
Local text confirms fiber-sensor/FPCB connections and closed-loop voltage control, supporting actual component/system integration.
Advanced Materials, 30 (10), 1704189 (2018)
Electrode–gel–biological actuator assembly supports functional integration, but the narrow BCCI interconnect–chip junction is not directly established.
Research on processes, junction structures and fabrication compatibility for joining different materials and components.
Advanced Healthcare Materials, 14(1), 2401735 (2025)
The central process joins electrodes, receiving coils and a soft substrate through different inks. Tissue contact and stimulation provide a secondary connection; placement does not rely on sensing performance alone.
npj Flexible Electronics, 8, 39 (2024)
Joining dry components and hydrogel–dry interfaces enables assembly of wearable and acute implanted devices. This is an extended component-integration assignment: heterogeneous material assembly extends beyond an interconnect–chip electrical junction.
Biosensors, 13(1), 83 (2023)
Substrate, electrode and channel fabrication/joining motivate a provisional manufacturing placement. Most systems are in vitro microfluidics rather than soft interconnect–component interfaces, so ambiguity is retained.
A provisional grouping for foundational materials or processes that may connect to this theme. It does not establish theme fit; each paper retains a rationale and ambiguity flag.
Small Science, 6(9), e70402 (2026)
The publisher abstract spans electrical contacts, heat transfer and skin conformity. As no single joining method dominates, retain integration foundations with tissue/routing cross-links and explicit cross-theme ambiguity.
ACS Applied Materials & Interfaces, 17(51), 70047 - 70058 (2025)
This foundational composite combines actuation, foaming and release. The abstract does not verify interconnect–chip or substrate–component joining, so integration is only a provisional foundation.
Small, 21(34), 2501590 (2025)
This industrial gas-membrane study addresses structural confinement and sealing. Without bioelectronic joining or host-response evidence, it is provisionally shelved only as interface-manufacturing foundations.
2022 IEEE International Ultrasonics Symposium (IUS), 1 - 4 (2022)
The transducer topic motivates a provisional component-foundations placement. Without the text, soft-substrate joining or biological-system assembly cannot be established.
Small, 18(14), 2107060 (2022)
The abstract describes optical wetting readout, not an interconnect–chip junction or in-host validation.
ACS Applied Nano Materials, 1(12), 6630-6640, (2018)
Without an abstract or full text, the registered-title-based foundational placement remains provisional; a host secondary tag is unsupported.
Sensors & Actuators B: Chemical, 267, 237-244 (2018)
Registered metadata alone does not establish an interconnect–chip integration contribution.
Advanced Functional Materials, 27 (29), 1701618 (2017)
Foundational nonbiological optical gas sensor; sensing performance alone does not establish chip connections or component joining.
Journal of Nanomaterials, 2015(1), 975043 (2015)
Checked sections support protective SERS shells and analytical measurements, not chip–soft-interconnect bonding. Retain integration foundations.
Journal of Materials Chemistry C, 3(39), 10293-10301 (2015)
The one-sentence registered summary supports only an InP MOS dielectric/passivation stack, not direct verification of a BCCI interface. Retain semiconductor foundations.
Nanomaterials, 5(3), 1493-1531 (2015)
The abstract covers textile components and energy harvesting/storage without specifying chip–interconnect integration. Retain integration foundations with secondary routing.
Scientific Reports, 5, 12326 (2015)
The abstract supports droplet manipulation, SERS and cellular delivery; droplet adhesion is not tissue adhesion or chip–interconnect joining. Retain integration foundations.
IEEE Transactions on Terahertz Science and Technology, 5 (4), 605-612 (2015)
The public PDF supports surface-trap/Auger carrier dynamics in Si nanowires. This is device-physics groundwork, not a component-assembly demonstration.
ACS Applied Materials & Interfaces, 7 (6), 3554-3561 (2015)
The abstract supports a PMMA-selective layer and Pd/graphene hydrogen sensor, not biofluid transport or chip–interconnect joining. Retain integration foundations.
Journal of Power Sources, 274, 1140-1146 (2015)
The public PDF concerns DTS-coated carbon-black catalyst corrosion in fuel cells. It remains an energy-materials foundation, without extrapolation to bioelectronic packaging.
RSC Advances, 5(8), 5754-5761 (2015)
The one-sentence registered summary supports an electrostatic droplet track. Droplet routing is not electrical routing; retain integration foundations.
Nanoscale Research Letters, 9, 610 (2014)
The abstract supports flexible SWNT/polymer X-ray sensing and transport trade-offs; flexibility alone does not establish chip joining or stretchable routing. Retain integration foundations.
RSC Advances, 4(104), 60123-60130 (2014)
Cu–SiO2 barrier/adhesion informs electronics foundations without establishing deformable routing or biofluid packaging.
ACS Applied Materials & Interfaces, 6 (12), 9053-9060 (2014)
SERS fabrication supports analytical foundations without established biological samples or chip-assembly interfaces.
ACS Nano, 7 (12), 10809-10817 (2013)
Flexible multicolour emission is verified, but remains optoelectronic foundations rather than bioelectronic joining.
Thin Solid Films, 524, 1-19 (2012)
This review spans materials, circuits and biointegration; it is an integration foundation rather than a single-interface experiment.
Small, 8 (10), 1614-1621 (2012)
Flexible FETs are verified, while separate chip–interconnect joining and BCCI assembly interfaces remain unverified.
Journal of Nanoparticle Research, 14(5), 840 (2012)
Surface smoothing and junction optoelectronics support semiconductor foundations rather than biological interfaces.
ACS Applied Materials & Interfaces, 3 (12), 4722-4729 (2011)
Droplet-routing platforms remain foundations without established tissue analyte transport or host response.
Journal of the Korean Physical Society, 59 (2), 501-504 (2011)
Heterojunction nanowire photodiodes do not demonstrate BCCI component–interconnect joining.
Applied Surface Science, 257 (11), 4973-4977 (2011)
UV-detector growth and substrate morphology remain foundations without direct soft-integration evidence.
Japanese Journal of Applied Physics, 49(10R), 104003 (2010)
MOS storage nodes and tunnelling concern electronics foundations rather than BCCI component joining.
Applied Surface Science, 255 (8), 4616-4622 (2009)
Transparent-electrode processing on glass supports electronics foundations without demonstrated soft or biological integration.