Interconnect–chip and substrate–component junctions. Classification centers on connecting and assembling functional components.
Connecting different materials and components involves more than electrical contact. A junction may also need to tolerate deformation, provide insulation and protect the device. This theme covers chip-to-soft-circuit connections, sensor-system assembly and encapsulation, alongside related materials and device-physics research.
d-HAPT: hydrogel-based joining of different materials uses a dried PVA/tannic acid adhesive layer to join metals, polymers and hydrogels. Its evidence concerns material adhesion and the stability of assembled devices under deformation; fine-pitch IC interconnection requires a separate evaluation.
The review on packaging rigid IC chips into deformable circuits compares prior work through adhesion, electrical junction stability and deformation tolerance. Read maximum strain separately from cyclic loading, alongside short circuits, open circuits and junction fatigue at closely spaced contacts.
MOLE: insulating encapsulation and an antifouling outer interface combines bonded silicone/Parylene C layers for mechanical integrity and moisture protection with a lubricant-infused surface. Accelerated tests at 85 °C and seven-day mouse subcutaneous implantation address different questions; they do not establish long-term implant lifetime or clinical benefit.
H-ACF is documented in a public presentation at the 2023 MRS Spring Meeting. It is identified here as conference material. Until a corresponding peer-reviewed journal DOI is verified, it is kept separate from the publication list below and is not treated as established IC-junction reliability evidence.
Research on assembling compatible component joints, electrical contacts and encapsulation structures. Protection and transport control also span the other themes.
Materials Science and Engineering R: Reports, 171, 101285 (2026)
Review of packaging rigid IC chips into soft electronics across three architectures and three interface requirements; sub-100 μm fine pitch is the key barrier.
Small, 22(17), e10949 (2026)
MOLE combines bonded silicone–Parylene C layers with a lubricated surface. Insulation was tested by accelerated aging at 85 °C, and device degradation and tissue responses by 7-day subcutaneous implantation in mice; these results do not establish a long-term human implant lifetime.
Advanced Electronic Materials, 11(19), e00475 (2025)
Review of OLED encapsulation from glass lids to thin-film hybrid multilayers, linking WVTR targets near 10−6 g m−2 day−1 to flexible and bioelectronic devices.
Connections between sensors, stimulation devices, actuators and circuits.
ACS Nano, 18(19), 12210-12224 (2024)
A wireless, chip-less strain-sensing suture followed a reconstructed porcine Achilles tendon for 10 weeks; strain fell to 5.83% (normal tendon: 4.38%).
Advanced Electronic Materials, 10(8), 2400013 (2024)
A self-healing, adhesive hydrogel-Ecoflex triboelectric nanogenerator gave about 180 V and 0.8 μA, and a power management circuit charged capacitors to 5 V.
ACS Nano, 17(8), 7296–7310 (2023)
Self-healing polymer vascular graft with a lubricant-swollen lumen and built-in CNT pressure sensor; it resealed 25G needle holes and sensed flow to 100 mL/min.
Nanoscale, 13(43), 18112-18124 (2021)
A core-shell electronic suture senses its own strain (gauge factor ~686) and releases drug from a heat-responsive shell, tested in cells and excised pig skin.
Advanced Materials, 30 (10), 1704189 (2018)
A stingray-like soft actuator with cardiomyocytes on patterned CNT–GelMA and PEG hydrogels and embedded Au microelectrodes was locally paced at 0.5 and 1.0 Hz.
Printing, bonding and other processes for combining different materials and components.
Advanced Healthcare Materials, 14(1), 2401735 (2025)
A vision-guided 6-axis robot printer made wound-matched wireless stimulation patches; in vitro, stimulation sped fibroblast and endothelial cell migration.
npj Flexible Electronics, 8, 39 (2024)
d-HAPT joins dissimilar electronic materials through moisture-induced chain entanglement in dried PVA–tannic acid layers. Dry–dry bonding uses interfacial water and heat; wet–dry bonding uses hydrogel moisture. Wet–wet and dry-material–tissue adhesion remain limited.
Biosensors, 13(1), 83 (2023)
A review classifying microfluidic impedance biosensors into six substrate types and contrasting flow cytometry of moving cells with impedance spectroscopy.
A provisional grouping for foundational materials or processes that may connect to this theme. It does not establish theme fit; each paper retains a rationale and ambiguity flag.
Small Science, 6(9), e70402 (2026)
Review of wearable thermoelectric devices that links skin contact, stretchable design and heat-flow paths to performance; Table 4 spans up to 25.34 μW cm−2 K−2.
ACS Applied Materials & Interfaces, 17(51), 70047 - 70058 (2025)
Nitinol–PMMA composite in which induction heating drives shape recovery and CO2 foaming; foaming raised impact strength by 142% and tuned model drug release.
Small, 21(34), 2501590 (2025)
PFPE sealing of a nanoribbon-rigidified ZIF-8 membrane gave ideal H2/N2 selectivity of 209; added plasma fluorination raised ideal H2/CH4 selectivity to 1218.
2022 IEEE International Ultrasonics Symposium (IUS), 1 - 4 (2022)
A capacitive micromachined ultrasonic transducer with nano-silicon springs beneath its plate gave a calculated surface pressure of 1.1 MPa at 5 VPP (220 kPa/V).
Small, 18(14), 2107060 (2022)
A liquid-permeable Fabry–Perot resonator turned voltage-driven water entry across about 10-nm gaps into a color change, shifting resonance by 87 nm in 0.6 s.
ACS Applied Nano Materials, 1(12), 6630-6640, (2018)
i-motif DNA cross-links dsDNA-wrapped carbon nanotubes into wet-spun microfibers with ∼27 S/cm conductivity, pH-switchable porosity and H2O2-responsive redox.
Sensors & Actuators B: Chemical, 267, 237-244 (2018)
An extended-gate FET carrying full-length histone H3 detected cathepsin L activity by substrate cleavage, reaching 1 ng/mL compared with 10 μg/mL for fluorometry.
Advanced Functional Materials, 27 (29), 1701618 (2017)
Slanted polymer nanofibers coated with palladium on one side straightened in 4 vol% hydrogen, raising light transmittance by about 65% with a 5.1 s response.
Journal of Nanomaterials, 2015(1), 975043 (2015)
Few-layer graphene grown on silver nanoparticles from PMMA blocked oxidation in air; a dye Raman peak went from 36,304 to 24,436, versus 113 on bare silver.
Journal of Materials Chemistry C, 3(39), 10293-10301 (2015)
An atomic-layer-deposited SiO2 interlayer under Ta1−xZrxO on InP cut capacitance dispersion from 21.1% to 11.3% and lowered leakage in MOS capacitors.
Nanomaterials, 5(3), 1493-1531 (2015)
Review of conductive textiles, fiber transistors, LEDs and pressure sensors, and textile energy harvesters and storage, with reported outputs and open problems.
Scientific Reports, 5, 12326 (2015)
Vacuum-formed dimples in a 275 μm thick superhydrophobic PDMS micro-pillar film steered water droplets; on-chip mixing raised GFP silencing from 70.0% to 78.8%.
IEEE Transactions on Terahertz Science and Technology, 5 (4), 605-612 (2015)
Terahertz probing of silicon nanowires showed Auger scattering offsetting surface-trap decay; SiO2-encapsulated wires had a carrier lifetime of around 1.1 ns.
ACS Applied Materials & Interfaces, 7 (6), 3554-3561 (2015)
A PMMA membrane over Pd nanoparticles on single-layer graphene blocked methane, CO and NO2, while the sensor gave a 66.37% average response to 2% hydrogen.
Journal of Power Sources, 274, 1140-1146 (2015)
A self-assembled DTS organosilane coating made carbon black fuel-cell supports hydrophobic and cut CO2 released in a 1.3 V corrosion test from 291 to 177 μL.
RSC Advances, 5(8), 5754-5761 (2015)
Capacitors 2 mm above a superhydrophobic Ag/Cu groove track switched the path of rolling 5 μL water drops without contact on a 3-inlet, 4-outlet track.
Nanoscale Research Letters, 9, 610 (2014)
Adding 0.01 wt.% carbon nanotubes to a flexible polymer X-ray detector raised sensitivity from 12.5 to 38.9 μC/mGy/cm3 at 150 V; 0.005 wt.% gave a better SNR.
RSC Advances, 4(104), 60123-60130 (2014)
A 2 nm coupled APTMS-MPA monolayer raised the Cu barrier's t63.2 four-fold over APTMS, comparable to 50 nm TaN, and annealed Cu/SiO2 adhesion energy by 33%.
ACS Applied Materials & Interfaces, 6 (12), 9053-9060 (2014)
Capillary forces of water printed Ag nanoparticle line arrays from buckled templates onto flat substrates without glue; the SERS arrays detected R6G at 10⁻¹² M.
ACS Nano, 7 (12), 10809-10817 (2013)
Polymer AC electroluminescent devices with carbon nanotubes, micelles and polymer blends gave blue, green and red emission of about 2300, 6000 and 5000 cd m⁻².
Thin Solid Films, 524, 1-19 (2012)
A 2012 review of nanomaterials on flexible substrates for piezoelectric energy harvesting, chemical and pressure sensing, and bio-integrated electronics.
Small, 8 (10), 1614-1621 (2012)
Silicon nanowires aligned at micro-engraved grooves during droplet evaporation were gravure-printed onto plastic, giving FETs with 17.1 cm²/V·s hole mobility.
Journal of Nanoparticle Research, 14(5), 840 (2012)
Rapid thermal oxidation and HF etching smoothed electroless-etched p–n+ silicon nanowires, raising forward current density about 6.3-fold at 4 V.
ACS Applied Materials & Interfaces, 3 (12), 4722-4729 (2011)
UV patterning of a DTS coating on superhydrophobic Si nanowires formed erasable hydrophilic tracks that guided 8 μL droplets at 6.91 cm/s at a 5° tilt.
Journal of the Korean Physical Society, 59 (2), 501-504 (2011)
Aqueous electroless etching made Si/SiGe/Si PIN nanowire photodiodes with a reverse dark current of 9.2 × 10⁻⁶ A, against 1.0 × 10⁻² A for bulk devices.
Applied Surface Science, 257 (11), 4973-4977 (2011)
ZnO nanowires grown by MOCVD in KOH-etched Si microcavities had higher aspect ratio and density; UV detectors there gave an on/off ratio of 6 and a 5 s decay.
Japanese Journal of Applied Physics, 49(10R), 104003 (2010)
Larger Pt nanocrystals (15.1 to 55.2 nm) in MOS memory capacitors raised the flatband voltage shift from 5.75 to 13.05 V; the smallest retained charge best.
Applied Surface Science, 255 (8), 4616-4622 (2009)
H2 annealing at 623 K reduced Ga2O3 and ZnGa2O4 in co-sputtered ZnO:Ga films, lowering resistivity to 5.2 × 10⁻⁴ Ω cm with transmittance over 90% of glass.